Technology / product information

FUJILLOY provides semiconductor molds designed for resin molding, cutting, and bending processes in semiconductor and electronics manufacturing. With micron-level accuracy, durable materials, and proven reliability, these molds support efficiency and quality improvements in chip, module, and electronic component production.

■ Features
・ Micron-level machining accuracy (±0.001mm) ensures consistent, defect-free results.
・ Durable materials such as tungsten carbide, ceramics, and high-hardness steel extend mold lifespan.
・ Advanced coatings (TiN, CrN, DLC) reduce wear and improve performance under demanding conditions.
・ Optimal material grade selection tailored to each semiconductor application.
・ Customization for customer-specific requirements, backed by a proven track record in global semiconductor production.

■ Specifications
・ Materials: Tungsten carbide, ceramics, high-hardness steel
・ Machining Precision: ±0.001mm tolerance
・ Coating Options: TiN, CrN, DLC surface treatments available
・ Size Range: From small-scale microcomponents to larger semiconductor module parts
・ Application Fit: Resin molding, precision cutting, bending processes

■ Applications
・ Semiconductor chips: High-precision resin molding ensures performance and long-term reliability
・ Electronic components: Cutting and bending molds improve accuracy and efficiency
・ Modules: Ensures stable production with consistent dimensional quality

FUJILLOY’s semiconductor molds deliver precision, durability, and productivity gains, making them a trusted choice for high-tech industries. By combining Japanese technology with global expertise, FUJILLOY supports the growing demand for advanced electronic manufacturing solutions.

■ For more details, please download the PDF or feel free to contact us.

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