Technology / product information

Molds for resin molding, cutting, and bending in semiconductor manufacturing require extremely high precision and durability. Fujilloy leverages years of experience and advanced technology to provide optimal grades and high-precision processing technology, manufacturing precise dies for electronic components and contributing to the high-tech industry. This enhances the efficiency and quality of semiconductor manufacturing processes.

Features
- High-Precision Processing: Advanced processing technology enables molds to be manufactured with micron-level precision.
- Durability: Advanced material selection and coating technology extend mold life and reduce maintenance costs.
- Optimal Grade Selection: Selects the optimal material grade for each application to maximize product performance.
- Customizable: Capable of designing and manufacturing molds tailored to specific customer requirements.
- Proven Track Record: Boasts numerous case studies in the semiconductor manufacturing field, ensuring high reliability.

Specifications
- Materials: High-hardness steel, tungsten carbide, ceramics, etc.
- Processing Accuracy: Achieves tolerances of ±0.001mm
- Coatings: TiN (Titanium Nitride), CrN (Chromium Nitride), DLC (Diamond-Like Carbon), etc.
- Supported Sizes: Accommodates from small electronic components to large semiconductor parts
- Applications: Resin molding, cutting, bending, etc.

Applications
- Semiconductor Chips: Enhances the reliability and performance of semiconductor chips through high-precision resin molding.
- Electronic Components: Improves the quality and production efficiency of electronic components through precise cutting and bending.
- Module Manufacturing: Ensures consistency and efficiency in module manufacturing with high-precision molds.

Fujilloy’s molds for semiconductor manufacturing provide extremely high precision and durability, meeting the needs of the high-tech industry.

For more details, please download the PDF or feel free to contact us.