Product Info

Epoxy resin is widely used as a sealing material for electronic components due to its excellent adhesive properties, insulation, and heat resistance. However, handling cured epoxy resin is extremely difficult, posing significant challenges, particularly in the repair and reprocessing of electronic devices. "E-Solve 21HE" is an advanced solution developed to address this issue. By simply immersing cured epoxy resin, it allows for easy dissolution, peeling, and swelling, supporting efficient and safe operations.

■ Features
- High dissolving power
Enables the dissolution, peeling, and swelling of cured epoxy resin in a short time.
- Improved work efficiency
Its rapid effect significantly reduces conventional work time.
- Safety
Uses low-toxicity components that consider workers' health, ensuring safe use.
- Reduced environmental impact
Environmentally friendly design simplifies post-use waste disposal.

■ Specifications
- Target: Cured epoxy resin sealing materials
- Form: Liquid
- Capacity: Available in 500ml, 1L, and 5L sizes
- Usage: Immerse the target material in the solution for a set time, then rinse with water after peeling
- Storage conditions: Store in a cool, dark place away from direct sunlight

■ Applications
- Repair and reprocessing of electronic devices
Removal of cured epoxy resin for reuse of substrates and components.
- Quality control in manufacturing
Removal of resin from defective sealed products or discarded materials.
- Maintenance of precision equipment
Removal of epoxy resin used in joints and components.

"E-Solve 21HE" dramatically improves the processing of cured epoxy resin, providing a safe and environmentally friendly solution. It is the ideal choice for smoothly advancing the repair and reprocessing of electronic devices and precision components.

KANEKO CHEMICAL (THAILAND) CO., LTD. is located in Pathum Thani Province and provides services throughout Thailand.

■ For more details, please download the PDF or feel free to contact us.